JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.
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By downloading this file the individual agrees not to charge for or resell the resulting material. The electrical test measurements shall consist of parametric and functional tests specified in the applicable procurement document.
For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.
This test may be destructive, depending on time, temperature and packaging if any. The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.
By downloading this file the individual agrees not to charge for or resell the resulting material. Learn more and apply today.
Standards & Documents Search | JEDEC
Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria for this stress. Current search Search found 2 items. Suite Arlington, VA 1. Requirement, clause number Test method number Clause number Fax: Search by Keyword or Document Number.
All comments will be collected and dispersed to the appropriate committee s. Table 1 — High Temperature storage conditions Condition A: This test may be destructive, depending on time, temperature and packaging if any. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included.
Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.
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Publications Department Wilson Blvd. Degradation of metals including metallurgical interfaces. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
During the test elevated temperatures accelerated test conditions are used without electrical stress applied. During the test, accelerated stress temperatures are used without electrical conditions applied. Some punctuation changes are not included. As a minimum the following items should be taken into consideration: Intermediate measurements are optional unless otherwise specified.
I recommend changes to the following: A margin test may be used to detect data retention degradation. Quality and Reliability of Solid State Products filter. Charge loss in Nonvolatile memories.
Table 1 — High temperature storage conditions Condition A: NC-A high-rate and lon For nonvolatile memories, the data jesd222 data retention pattern must be written initially, and then subsequently verified without re-writing. If you can provide input, please complete this form and return to: The information jesd2 in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
The devices may be returned to room ambient conditions or any other defined temperature for interim electrical measurements. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes.
This test may be destructive, depending on Time, Temperature and Packaging if any. Modified item C to jdsd22 reference of stress duration requirement. If the final readpoint time window is exceeded then the units may be restressed for the same amount of time that the kesd22 is exceeded.
The time window need not be met if verification data for a given technology is provided. Solid State Memories JC Other conditions and durations may be used as appropriate. A margin test may be used to detect data retention degradation. Requirement, clause number Test method number The referenced clause number has proven to be: Moisture soak as part of the jeed22 is optional. If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included.